IoT News – SIMCom 5G Module SIM8202G-M2 Makes Its World Debut – Small Size Connects the Great 5G Era


On the 14th IOTE, SIMCom launched an ultra-small 5G module SIM8202G-M2 with the brand new 4-antenna design, to help the sustainable growth of the trade.

SIM8202G-M2 is a small-size multi-band 5G module, which helps NSA/SA networking and covers all frequency bands of main community carriers world wide. It adopts the usual M2 interface and its AT command set is appropriate with SIM7912G / SIM8200X-M2 modules, which may reduce the funding value and velocity up the market launch for patrons. In contrast with different 5G modules, it’s tremendously improved within the following facets.

1. New 4-antenna design

SIM8202G-M2 adopts a brand new 4-antenna design, which successfully will increase communication capability, sends and receives knowledge in an lively method, and maintains excessive knowledge velocity and stability.

2. Extremely-small dimension

The scale of SIM8202G-M2 is barely 30*42mm. The discount in dimension brings nice challenges to expertise and course of design. The rise in inner parts results in a denser part structure, inflicting restricted energy line routing width, tougher isolation and safety of the high-rate sign line, RF-sensitive line, clock sign and tougher managed impedance routing. Due to this fact, SIMCom repeatedly optimized the design and deleted redundant design. Elements with smaller package deal dimensions, larger efficiency and extra dependable high quality are adopted to successfully meet the multi-band/high-performance/high-bandwidth/multi-system necessities of 5G modules.

3. Giant uncovered copper space facilitates warmth dissipation

The transmission charge of 5G modules is tremendously elevated. The will increase in energy consumption by CPU, RF transceiver and RF PA all generate extra warmth in modules. To make sure the module can work stably for a very long time, the design of SIM8202G-M2 takes full account of the structure of heating parts, ensuring the principle heating parts have ample holes to base. On the similar time, a big uncovered copper space is designed on the again of the module to facilitate the warmth dissipation of the module by silica gel.

SIM8202G-M2 options high-speed transmission and low latency. It may be broadly utilized in terminals for VR, AR, CPE, IoV, IIoT and 4K /8K HD video.


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